Due to the rapid growth of the AI market, high performance, low power, and high reliability are required for semiconductors at the same time, and precise quality control across design, process, and manufacturing is essential to realize this. Among them, particle acts as a representative defect factor and is continuously studied as a key cause of poor yield and reliability. Semiconductor defects are classified into three categories: device characteristics (parametric), process/design characteristics (systematic), and byproducts (random). In the past, defect was defined as random defects due to particle to control physical removal oriented control, but depending on process complexity and miniaturization, existing definitions alone are limited, and it is necessary to expand and understand and control defect from a systematic perspective. Currently, the defect control system is upgrading removal technologies such as clean and filtration, creation, and control technologies that prevent wafer transcription as key indicators of the number of defects per unit area (D0). However, the limitations are becoming clear only with the existing approach, and in particular, as the number of fine defects that are difficult to detect with the existing inspection system is increasing, high resolution inspection infrastructure and precision control technology that can detect and control them are essential. In this lecture, we will point out the limitations of the existing defect concept and present a new defect control paradigm for the next-generation AI memory market.
In semiconductor manufacturing, various types of contamination cause yield reduction. As an introduction, the effects of contamination on semiconductor devices will be presented. Based on that, semiconductor cleaning will be explained. Wet cleaning, recent cleaning, and cleaning for specific purposes will be explained in detail. Contamination control technologies other than cleaning will be introduced. Finally, next-generation contamination control issues and cleaning and drying technologies will be explained. We will teach contamination control technologies other than cleaning, monitoring technologies, wafer surface analysis technologies, and optimal factory design.
Cleanroom is the lifeline for ensuring semiconductor production yield, but the complex environment control of cross operations, high energy consumption, and high cost have always been industry challenges. In the field of electronic semiconductor manufacturing, the stable operation and energy consumption management of cleanroom ventilation systems have always been a difficult point that the industry pays attention to but neglects. How to achieve energy conservation and consumption reduction while ensuring high yield? How to solve the pain points of clean room operation through scientific management and technological innovation? Where does clean room energy consumption come from? How to quantify analysis? How to achieve a balance between operational management and process yield through data-driven approaches? This speech will start from practical cases and elaborate on the core concept and technical path of energy saving and consumption reduction in semiconductor cleanroom ventilation systems. It points out how to choose suitable filter products and optimize clean room operation management strategies through data analysis, achieving a dynamic balance between energy consumption and cleanliness. In short, energy conservation is not simply about replacing equipment, but about the full chain technology integration from diagnosis, design, selection to operation and maintenance.
General Manager of SHENZHEN ESKY Purify Technology Co., LtdInternationally Certified Cleanroom Engineer accredited by ICEB (International Cleanroom Education Board)Member of ICCCS (International Confederation of Contamination Control Society)Vice Chairman of the Cleanroom Technology Committee, Chinese Institute of ElectronicsPresident of the Standardization Professional Committee, Shenzhen Bio-Industrial Cleanroom Industry AssociationMember of the Laboratory Construction and Development Branch, National Association of Health Industry Enterprise Management
The group standard, Guidelines for airborne chemical contamination control of laboratories, initiated by QUNYAN XIA, was officially implemented on June 20, 2024, filling the gap in chemical pollution control for laboratories in China. Additionally, QUNYAN XIA is co-editing the national standard, Services specification for operation and maintenance for clean rooms and associated controlled environments.
